High Power RF Capacitor Wiring Diagram

What is a ceramic RF power capacitor?

The ceramic RF power capacitor can be defined as an electrical device consisting of a ceramic dielectric with conductive noble-metal electrodes, terminations, and a protective coating. The spectrum of capacitance values extends from the lower picofarad range up to the nanofarad range. The rated voltages range from 636 Vpeak up to 40 000 Vpeak.

Which capacitors are best suited for high RF power applications?

It is interesting to note that capaci- tors that exhibit ultra-low ESR as well as high voltage breakdown characteristics (such as porcelain types) are especially well suited for high RF power applications. Fig. 1 Current flow through a capacitor with series loss element.

Are ceramic chip capacitors a good choice for high RF power applications?

RF CERAMIC CHIP CAPACITORS IN HIGH RF POWER APPLICATIONS In today’s world of wireless communica- tions systems there are a myriad of high RF power applications that necessitate the use of high quality specialized ceramic chip capacitors. These demands require the de- signer to carefully ac- count for factors such

How to deter RF power dissipation of a ceramic capacitor?

In order to deter- mine the device power dissipation of a ceramic capacitor operating in an RF power application the circuit designer must consider several critical factors. Among the most prominent are the equivalent series resistance (ESR) and maximum operating cir- cuit current (Imax).

How do you calculate RF power dissipated by a capacitor?

The total RF current in this application is deter- mined using Therefore, the total power dissipated in the capacitor is PCD = IC 2 ESR × = (1.09)2 × (0.061) = 0.072 W (72 mW) This example illustrates the impor- tance of the relationship between ESR and the total power dissipated by the capacitor.

What factors should be considered in high RF power design applications?

“To ensure the highest level of reliability in high RF power design applications, factors such as maximum device power, maximum voltage and current ratings, thermal characteristics of all circuit devices and various ways that heat is removed should be taken into account before being incorporated into the end product design.”